Akasa AK-460 Thermal Compound heat sink compound 3.3 W/m·K 3.5 g

Pro-Grade Silicone Technology Evolution leads to Outstanding Thermal Performance Pro-grade Silicone technology evolution thermal compound delivers a stable and reliable thermal performance. Minimised resistance and maximised efficiency truly enables you to get more from your cooler. RoHS compliant. Features - Outstanding performance of heat transfer between CPU and heatsink. - Low thermal resistance for heat transfer. 0.16cm²C/W @60 um BLT. - Maximum thermal conductivity. 3.3W/mK. - Electrically non-conductive. - Low bleed under high pressure. - Multi-language instructions included.