Akasa T5 Pro-Grade+ heat sink compound Thermal paste 5.2 W/m·K 5 g

Designed with hybrid silicone and nano-diamond particles for ultra-performance. Non-curing and non-electrically conductive properties. Conveniently included wipes and spreader. Nano-Diamond Particles for Superior Heat Transmission. Use of hybrid silicone and nano diamond micro particles ensures minimal thermal resistance for quick and efficient heat transmission. Getting the most out of your processor, air and liquid heatsink cooler. Making it perfect for overclockers.. Easy and Safe Application. Non-curing paste means no time required to wait for curing process reaching its highest performance right from the get-go. Non-conductive properties ensures that there is no electrical risk with components.. Conveniently Included Wipes and Spreader. Easy application with included spreader to get an even coating on CPU or GPU for best efficiency. Wipes also included to clean old paste to make sure a good bond is established with heatsink.. Features. Operating temperature (T-T). -50 - 250 °C. Viscosity note. 6000000. Thermal resistance. 0.04 °C/W. Specific gravity. 2.6 g/cm³. Product colour. Grey. Thermal conductivity. 5.2 W/m·K. Type. Thermal paste. Weight & dimensions. Weight. 5 g. Packaging data. Quantity per pack. 1 pc(s). manual pdf